JPH0513185B2 - - Google Patents

Info

Publication number
JPH0513185B2
JPH0513185B2 JP60161286A JP16128685A JPH0513185B2 JP H0513185 B2 JPH0513185 B2 JP H0513185B2 JP 60161286 A JP60161286 A JP 60161286A JP 16128685 A JP16128685 A JP 16128685A JP H0513185 B2 JPH0513185 B2 JP H0513185B2
Authority
JP
Japan
Prior art keywords
resin
epoxy
resin composition
butadiene
type phenolic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60161286A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222825A (ja
Inventor
Kazuhiro Sawai
Masanori Kokubo
Hiroyuki Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP16128685A priority Critical patent/JPS6222825A/ja
Publication of JPS6222825A publication Critical patent/JPS6222825A/ja
Publication of JPH0513185B2 publication Critical patent/JPH0513185B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP16128685A 1985-07-23 1985-07-23 封止用樹脂組成物 Granted JPS6222825A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16128685A JPS6222825A (ja) 1985-07-23 1985-07-23 封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16128685A JPS6222825A (ja) 1985-07-23 1985-07-23 封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6222825A JPS6222825A (ja) 1987-01-31
JPH0513185B2 true JPH0513185B2 (en]) 1993-02-19

Family

ID=15732219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16128685A Granted JPS6222825A (ja) 1985-07-23 1985-07-23 封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6222825A (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0791446B2 (ja) * 1987-03-31 1995-10-04 株式会社東芝 樹脂封止半導体装置
JP2877309B2 (ja) * 1988-01-06 1999-03-31 株式会社東芝 ゴム変性フェノール樹脂の製造方法
JP2660012B2 (ja) * 1988-09-13 1997-10-08 株式会社東芝 ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置
JPH02110127A (ja) * 1988-10-19 1990-04-23 Toshiba Chem Corp 封止用樹脂組成物
JP2642470B2 (ja) * 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置
CA2010331A1 (en) * 1989-03-02 1990-09-02 James O. Peterson Low stress epoxy encapsulant compositions
KR100805505B1 (ko) * 2004-02-16 2008-02-20 미츠비시 레이온 가부시키가이샤 수지용 개질제 및 이것을 이용한 수지 조성물, 및 성형품

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108220A (ja) * 1981-12-21 1983-06-28 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS601220A (ja) * 1983-06-17 1985-01-07 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物
JPS5975922A (ja) * 1982-10-23 1984-04-28 Denki Kagaku Kogyo Kk エポキシ樹脂系成形材料
JPS61208856A (ja) * 1985-03-14 1986-09-17 Nitto Electric Ind Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6222825A (ja) 1987-01-31

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